Tanmatsu/WHY2025 badge PCB design
This talk delves into the technical aspects of the Tanmatsu hardware design, the latest creation by the badge team, set to be released alongside the availability of ESP32-P4 chips. It will also form the foundation for the WHY2025 badge. Topics include an exploration of the PCB's high-level design, cost considerations for producing 4000 units, challenges and insights from working with pre-release chip prototypes, and a discussion on the practical aspects of MIPI DSI/SCI interfaces, including LVDS and impedance. The session will share both the hurdles and triumphs encountered during the design process.
A talk about the technical aspects of the hardware design of the latest hardware design created by badge team.
The Tanmatsu hardware design is finished, and will be available for the community as soon as the ESP32-P4 chips are available. The design will also be the bases for the WHY2025 badge.
In this talk we'll take a deep dive into developing a badge project in a neurodiverse community:
- PCB high level design
- Cost considerations when designing a 4000x PCB
- Some horror and beauty on the design path
- MIPI DSI/SCI (LVDS, multi layer, impedance and clearance)
- Mass production considerations
Licensed to the public under http://creativecommons.org/licenses/by/4.0